SEMICONDUCTOR MANUFACTURING SYSTEM AND METHOD
案件概要
発明者
Yi LI; Brandon MARIN; Zhixin XIE; Praveen SREERAMAGIRI; Ibrahim EL KHATIB; Robin McREE; Jesse JONES; Srinivas PIETAMBARAM; Gang DUAN; Manohar KONCHADY
IPC分類
CPC分類
There may be provided a system that includes a workpiece-support assembly with a platform. The system may further include an alignment-detection assembly with an optical sensor oriented towards the platform. The system may further include a handling assembly with at least one manipulator positioned along at least a first movement plane that is substantially parallel with the platform or at least a second movement plane that is substantially perpendicular to the platform. The system may further include a bonding assembly with a dispenser positioned over the platform. The system may further include a fiducial-marking assembly with a drill oriented towards the platform. The system may further include a controller electrically connected to each of the optical sensor, the at least one manipulator, the dispenser, and the drill.
原文（中国語）
There may be provided a system that includes a workpiece-support assembly with a platform. The system may further include an alignment-detection assembly with an optical sensor oriented towards the platform. The system may further include a handling assembly with at least one manipulator positioned along at least a first movement plane that is substantially parallel with the platform or at least a second movement plane that is substantially perpendicular to the platform. The system may further include a bonding assembly with a dispenser positioned over the platform. The system may further include a fiducial-marking assembly with a drill oriented towards the platform. The system may further include a controller electrically connected to each of the optical sensor, the at least one manipulator, the dispenser, and the drill.
外部リソース