SEMICONDUCTOR PACKAGE HAVING SIDE PROTECTIONS AND METHOD OF MAKING THE SAME

原文（中国語）

A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a plated metal layer, and a molding encapsulation. The molding encapsulation directly contacts an entirety of each side surface of a plurality of side surfaces of the semiconductor substrate, and an entirety of each side surface of a plurality of side surfaces of the plated metal layer. A method comprises the steps of providing a semiconductor device wafer; applying a first thinning process; applying a dicing process; attaching a panel; forming a first molding encapsulation; applying a second thinning process, forming a plurality of plated metal sections, removing the panel, and applying a singulation process.