APPARATUS AND DEVICES FOR CHIP-TO-CHIP COMMUNICATION

原文（中国語）

An integrated circuit device including: a plurality of integrated circuit dies, wherein each integrated circuit die of the plurality of integrated circuit dies is configured to receive or transmit a respective baseband signal; and a further integrated circuit die including: a plurality of front-end circuits, wherein each front-end circuit of the plurality of front-end circuits is coupled to a respective integrated circuit die of the plurality of integrated circuit dies.