HYBRID COOLING SYSTEM AND ELECTROMAGNETIC INTERFERENCE SHIELD
案件概要
発明者
Kari Pekka Johannes Mansukoski; Sami M. Heinisuo; Jeff Ku; Luis Carlos Paniagua Acuña; Shawn S. McEuen
IPC分類
CPC分類
Devices and systems for cooling and shielding electromagnetic interference (EMI) are disclosed herein. In one example, a device includes a vapor chamber and one or more heat pipes coupled to the vapor chamber, where the heat pipes are at least partially below the vapor chamber. The heat pipes are to be coupled to a circuit board such that the heat pipes and the vapor chamber form at least a portion of an EMI shield around at least a portion of integrated circuitry on the circuit board.
原文（中国語）
Devices and systems for cooling and shielding electromagnetic interference (EMI) are disclosed herein. In one example, a device includes a vapor chamber and one or more heat pipes coupled to the vapor chamber, where the heat pipes are at least partially below the vapor chamber. The heat pipes are to be coupled to a circuit board such that the heat pipes and the vapor chamber form at least a portion of an EMI shield around at least a portion of integrated circuitry on the circuit board.
外部リソース