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案件記録

Mounting Body, Ultrasonic Sensor, And Multi-Feed Detection Device

発明審査中
1閲覧数
8請求項 · 2 独立
§ Ⅰ

案件概要

発明者

Masayoshi YAMADA; Hikaru IWAI; Eiji OSAWA; Kiichi TAKEDA

IPC分類

H5K 1/18G1H 11/8H5K 1/2

CPC分類

H5K1/18G1H11/8H5K1/298H5K2201/10151

The circuit substrateincludes the first wiring layerelectrically coupled to the circuit, the element substrateincludes a first substrate, a diaphragm, a piezoelectric element, the second substrate, and a second wiring layerelectrically coupled with the piezoelectric element, and it includes the third wiring layercoupled with the first wiring layerand second wiring layer, and the protectorthat covers the third wiring layer

原文(中国語)

The circuit substrateincludes the first wiring layerelectrically coupled to the circuit, the element substrateincludes a first substrate, a diaphragm, a piezoelectric element, the second substrate, and a second wiring layerelectrically coupled with the piezoelectric element, and it includes the third wiring layercoupled with the first wiring layerand second wiring layer, and the protectorthat covers the third wiring layer

外部リソース