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案件記録

CIRCUIT ASSEMBLY

発明審査中
3閲覧数
8請求項 · 1 独立
§ Ⅰ

案件概要

発明者

Koushi IGURA; Hiroki SHIMODA; Taiji YANAGIDA

IPC分類

H5K 5/2H2G 5/6

CPC分類

H5K5/217H2G5/6

A circuit assembly that can reduce stress generated at an interface between a heat conducting member and a case is disclosed. A circuit assemblyincludes: heat generating componentsa bus barconnected to connector portionsof the heat generating componentsa casethat houses the heat generating componentsand the bus barand a heat conducting memberthat is placed on a mounted surfaceof the caseis in thermal contact with the caseand the bus barand is sandwiched therebetween. The caseincludes a displacement restricting portionthat engages with a heat conductive memberand restricts displacement of the heat conducting member

原文(中国語)

A circuit assembly that can reduce stress generated at an interface between a heat conducting member and a case is disclosed. A circuit assemblyincludes: heat generating componentsa bus barconnected to connector portionsof the heat generating componentsa casethat houses the heat generating componentsand the bus barand a heat conducting memberthat is placed on a mounted surfaceof the caseis in thermal contact with the caseand the bus barand is sandwiched therebetween. The caseincludes a displacement restricting portionthat engages with a heat conductive memberand restricts displacement of the heat conducting member

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