検索に戻る
案件記録

NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE

発明審査中
1閲覧数
20請求項 · 3 独立
§ Ⅰ

案件概要

IPC分類

H10B 51/30H10B 43/10H10B 43/27H10B 43/35H10B 43/40H10B 51/10H10B 51/20H10B 51/40

CPC分類

H10B51/30H10B43/10H10B43/27H10B43/35H10B43/40H10B51/10H10B51/20H10B51/40

According to one embodiment, a non-volatile semiconductor memory device includes a plurality of first interconnect layers stacked apart from each other, a memory pillar passing through the plurality of first interconnect layers, a local bit line electrically coupled to the memory pillar, a bit line, a plurality of second interconnect layers stacked apart from each other, a first pillar passing through the plurality of second interconnect layers and electrically coupled to the local bit line, a second pillar passing through the plurality of second interconnect layers and electrically coupled to the bit line and the first pillar, a plurality of third interconnect layers stacked apart from each other, and a third pillar passing through the plurality of third interconnect layers and electrically coupled to the bit line. At least one of the plurality of third interconnect layers is electrically coupled to the local bit line.

原文(中国語)

According to one embodiment, a non-volatile semiconductor memory device includes a plurality of first interconnect layers stacked apart from each other, a memory pillar passing through the plurality of first interconnect layers, a local bit line electrically coupled to the memory pillar, a bit line, a plurality of second interconnect layers stacked apart from each other, a first pillar passing through the plurality of second interconnect layers and electrically coupled to the local bit line, a second pillar passing through the plurality of second interconnect layers and electrically coupled to the bit line and the first pillar, a plurality of third interconnect layers stacked apart from each other, and a third pillar passing through the plurality of third interconnect layers and electrically coupled to the bit line. At least one of the plurality of third interconnect layers is electrically coupled to the local bit line.

外部リソース