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案件記録

III-V COMPOUND SEMICONDUCTOR FIELD-EFFECT TRANSISTOR GATE STRUCTURE COMPRISING A FIELD PLATE WITH CURVED SIDEWALLS

発明審査中
2閲覧数
7請求項 · 1 独立
§ Ⅰ

案件概要

出願人

UNITED MICROELECTRONICS CORP.

発明者

Chih-Tung Yeh

IPC分類

H10D 30/1H10D 30/47H10D 62/85H10D 64/

CPC分類

H10D30/15H10D30/475H10D62/8503H10D64/111

A semiconductor device includes a substrate, a III-V compound semiconductor layer, a gate structure, a drain structure, a field plate, and an electrically conductive barrier layer. The III-V compound semiconductor layer is disposed on the substrate. The gate structure, the drain structure, and the field plate are disposed above the III-V compound semiconductor layer. The field plate is located between the gate structure and the drain structure and includes a first curved sidewall located at an edge of the field plate adjacent to the drain structure. The gate structure is directly connected with the field plate and the electrically conductive barrier layer. The first curved sidewall is directly connected with a top surface and a bottom surface of the field plate. An included angle between the top surface and the first curved sidewall is less than an included angle between the bottom surface and the first curved sidewall.

原文(中国語)

A semiconductor device includes a substrate, a III-V compound semiconductor layer, a gate structure, a drain structure, a field plate, and an electrically conductive barrier layer. The III-V compound semiconductor layer is disposed on the substrate. The gate structure, the drain structure, and the field plate are disposed above the III-V compound semiconductor layer. The field plate is located between the gate structure and the drain structure and includes a first curved sidewall located at an edge of the field plate adjacent to the drain structure. The gate structure is directly connected with the field plate and the electrically conductive barrier layer. The first curved sidewall is directly connected with a top surface and a bottom surface of the field plate. An included angle between the top surface and the first curved sidewall is less than an included angle between the bottom surface and the first curved sidewall.

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