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案件記録

Contact Structure For Semiconductor Device

発明審査中
3閲覧数
20請求項 · 3 独立
§ Ⅰ

案件概要

発明者

Mrunal Abhijith KHADERBAD; Keng-Chu LIN; Ko-Feng CHEN; Yu-Yun PENG

IPC分類

H10D 30/1H10D 30/62H10D 62/13H10D 62/17H10D 84/1H10D 84/3

CPC分類

H10D30/24H10D30/6211H10D62/151H10D62/235H10D84/158H10D84/38

The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, first and second contact structures proximate to each other and over the substrate, and first and second dielectric layers formed over the first and second contact structures, respectively. A top portion of the first dielectric layer can include a first dielectric material. A bottom portion of the first dielectric layer can include a second dielectric material different from the first dielectric material. The second dielectric layer can include a third dielectric material different from the first dielectric material.

原文(中国語)

The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, first and second contact structures proximate to each other and over the substrate, and first and second dielectric layers formed over the first and second contact structures, respectively. A top portion of the first dielectric layer can include a first dielectric material. A bottom portion of the first dielectric layer can include a second dielectric material different from the first dielectric material. The second dielectric layer can include a third dielectric material different from the first dielectric material.

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