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案件記録

THIN FILM TRANSISTORS HAVING REPLACEMENT CONTACT METALLIZATION

発明審査中
20請求項 · 3 独立
§ Ⅰ

案件概要

出願人

Intel Corporation

発明者

Honore DJIEUTEDJEU; Vinaykumar V. HADAGALI; Yu-Wen HUANG; Abhishek Anil SHARMA; Van H. LE; Nikhil MEHTA; Christopher J. WIEGAND

IPC分類

H1L 29/786H1L 29/40H1L 29/417H1L 29/66H10B 12/

CPC分類

H10D30/6755H10D30/6729H10D30/6757H10D64/1H10D99/H10B12/30

Thin film transistors are described. An integrated circuit structure includes a gate electrode. A gate dielectric layer is on the gate electrode. A channel material layer is on the gate dielectric layer. Source or drain contacts are on the channel material layer. Each of the source or drain contacts has a first sidewall in contact with a dielectric backbone, and a second sidewall in contact with an insulating material having a composition different than the dielectric backbone.

原文(中国語)

Thin film transistors are described. An integrated circuit structure includes a gate electrode. A gate dielectric layer is on the gate electrode. A channel material layer is on the gate dielectric layer. Source or drain contacts are on the channel material layer. Each of the source or drain contacts has a first sidewall in contact with a dielectric backbone, and a second sidewall in contact with an insulating material having a composition different than the dielectric backbone.

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