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案件記録

SEMICONDUCTOR DEVICE WITH PROGRAMMABLE STRUCTURE AND METHOD FOR FABRICATING THE SAME

発明審査中
15請求項 · 1 独立
§ Ⅰ

案件概要

IPC分類

H1L 29/78H1L 29/423

CPC分類

H10D30/711H10D64/512H10D64/514H10D64/517

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a peripheral impurity region positioned in the substrate; a top electrode layer positioned in the peripheral impurity region and protruding upwardly from the substrate; and a middle insulating layer inwardly positioned in the peripheral impurity region and partially surrounding the top electrode layer to separate the peripheral impurity region and the top electrode layer. The peripheral impurity region, the middle insulating layer, and the top electrode layer together configure a programmable structure.

原文(中国語)

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a peripheral impurity region positioned in the substrate; a top electrode layer positioned in the peripheral impurity region and protruding upwardly from the substrate; and a middle insulating layer inwardly positioned in the peripheral impurity region and partially surrounding the top electrode layer to separate the peripheral impurity region and the top electrode layer. The peripheral impurity region, the middle insulating layer, and the top electrode layer together configure a programmable structure.

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