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案件記録

INTEGRATED CIRCUIT STRUCTURES HAVING STRESS-INDUCING GATE CUT PLUGS

発明審査中
1閲覧数
20請求項 · 3 独立
§ Ⅰ

案件概要

発明者

Tao CHU; Guowei XU; Robin CHAO; Feng ZHANG; Ting-Hsiang HUNG; Chia-Ching LIN; Yang ZHANG; Kan ZHANG; Chun Wing YEUNG; Minwoo JANG; Yanbin LUO; Chung-Hsun LIN; Anand S. MURTHY; Paul A. PACKAN

IPC分類

H1L 29/78H1L 21/28H1L 21/8238H1L 27/92H1L 29/6H1L 29/423H1L 29/66H1L 29/775H1L 29/786

CPC分類

H10D30/795H1L21/28123H10D30/14H10D30/43H10D30/6735H10D30/6757H10D62/121H10D84/188H10D84/38H10D84/85

Integrated circuit structures having stress-inducing gate cut plugs are described. For example, a structure includes a first vertical stack of horizontal nanowires or fin over a first sub-fin. A first gate structure is over the first vertical stack of horizontal nanowires or fin. A second vertical stack of horizontal nanowires or fin is over a second sub-fin. A second gate structure is over the second fin. A gate cut separates a first gate electrode of the first gate structure from a second gate electrode of the second gate structure. A gate cut fill structure is in the gate cut, the gate cut fill structure including a first dielectric material portion in contact with the first gate electrode, a conductive via portion, and a second dielectric material portion in contact with the second gate electrode. The conductive via portion separates the first dielectric material portion from the second dielectric material portion.

原文(中国語)

Integrated circuit structures having stress-inducing gate cut plugs are described. For example, a structure includes a first vertical stack of horizontal nanowires or fin over a first sub-fin. A first gate structure is over the first vertical stack of horizontal nanowires or fin. A second vertical stack of horizontal nanowires or fin is over a second sub-fin. A second gate structure is over the second fin. A gate cut separates a first gate electrode of the first gate structure from a second gate electrode of the second gate structure. A gate cut fill structure is in the gate cut, the gate cut fill structure including a first dielectric material portion in contact with the first gate electrode, a conductive via portion, and a second dielectric material portion in contact with the second gate electrode. The conductive via portion separates the first dielectric material portion from the second dielectric material portion.

外部リソース