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案件記録

HETEROEPITAXIAL WAFER FOR THE DEPOSITION OF GALLIUM NITRIDE

発明審査中
15閲覧数
12請求項 · 1 独立
§ Ⅰ

案件概要

発明者

Brian MURPHY; Sarad Bahadur THAPA

IPC分類

H10D 62/85H1L 21/2

CPC分類

H10D62/8503H1L21/2381H1L21/2458H1L21/254

A heteroepitaxial wafer includes, in the following order: (1) a substrate made of silicon having a thickness, a diameter, a crystal orientation, a resistivity, a frontside, and a backside; (2) a nucleation layer comprising aluminium nitride (AlN) and 3C-SiC; (3) a first boron nitride layer having a first boron nitride layer thickness; and (4) a layer of nitride having a nitride layer thickness comprising an element out of the list of elements of aluminum, gallium, indium and thallium.

原文(中国語)

A heteroepitaxial wafer includes, in the following order: (1) a substrate made of silicon having a thickness, a diameter, a crystal orientation, a resistivity, a frontside, and a backside; (2) a nucleation layer comprising aluminium nitride (AlN) and 3C-SiC; (3) a first boron nitride layer having a first boron nitride layer thickness; and (4) a layer of nitride having a nitride layer thickness comprising an element out of the list of elements of aluminum, gallium, indium and thallium.

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