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案件記録

SELECTIVE TEMPLATED ALIGNED AT RECESS DUAL METAL GATE PATTERNING

発明審査中
20請求項 · 3 独立
§ Ⅰ

案件概要

出願人

Intel Corporation

発明者

Orb Acton; Guowei Xu; Niangao Duan; Petr Novotny; Omair Saadat; Gianna Di Francesco; Lukas Baumgartel; David Towner; Oleg Golonzka; Dax Crum; Dan Lavric; Angeline Smith; Joseph Saunders

IPC分類

H10D 84/3H10D 30/67H10D 62/10H10D 64/66H10D 84/1H10D 84/85

CPC分類

H10D84/38H10D30/6735H10D30/6757H10D62/118H10D64/667H10D84/167H10D84/177H10D84/85

Integrated circuit (IC) devices having shared, dual-metal gates for complementary transistors. An IC device includes a shared gate structure over first and second stacks of nanoribbons with complementary conductivities and a substrate, and the gate structure includes first, second, and third gate metals with the first gate metal over and around the nanoribbons in the first stack, the second gate metal over and around the nanoribbons in the second stack, and the third gate metal around and between the nanoribbons in the first stack, between the first and second stacks, in contact with both the first and second gate metals, and extending beyond the first metal over the substrate. The first gate metal may act as a temple for selective deposition of the third gate metal. The second gate metal may be conformally deposited over the nanoribbons in the second stack and on the third gate metal.

原文(中国語)

Integrated circuit (IC) devices having shared, dual-metal gates for complementary transistors. An IC device includes a shared gate structure over first and second stacks of nanoribbons with complementary conductivities and a substrate, and the gate structure includes first, second, and third gate metals with the first gate metal over and around the nanoribbons in the first stack, the second gate metal over and around the nanoribbons in the second stack, and the third gate metal around and between the nanoribbons in the first stack, between the first and second stacks, in contact with both the first and second gate metals, and extending beyond the first metal over the substrate. The first gate metal may act as a temple for selective deposition of the third gate metal. The second gate metal may be conformally deposited over the nanoribbons in the second stack and on the third gate metal.

外部リソース