METHOD FOR MANUFACTURING IMAGE SENSING DEVICE AND IMAGE SENSING DEVICE

原文（中国語）

A method for manufacturing an image sensing device and an image sensing device are provided. The method includes steps as follows. An image sensing chip is fixed on an upper surface of a carrier substrate. Metal wires are provided to respectively connect chip pads of an image sensing chip with substrate pads of the carrier substrate. A cover board is provided, and a limiting dam is formed on a bottom surface of the cover board. The limiting dam is arranged to surround a sensing area of the image sensing chip and is fixed between the sensing area and the substrate pads. Then, the cover board and the limiting dam are removed. A sealing material wall covers the chip pads and completely covers the metal wires. Finally, the cover board covers above the image sensing chip, and is adhered to the sealing material wall by an adhesive layer.