LEAD FRAME STRUCTURES FOR REFLOW MITIGATION IN LIGHT-EMITTING DIODE (LED) PACKAGES

原文（中国語）

Light-emitting diode (LED) devices and more particularly lead frame structures for reflow mitigation in LED packages are disclosed. Lead frame structures include various features positioned within a recess of a package housing and proximate mounting areas of LED chips within the recess. The features may include nonplanar shapes relative to a floor of the recess that promote increased adhesion with an encapsulant in the recess while also mitigating effects of reflow when the package is later bonded at a device level. Exemplary nonplanar shapes include portions of leads that extend upward into the recess and/or portions of leads that extend downward below the floor of the recess. The features may be arranged in rows, as islands, or even as random structures along portions of the leads.