LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE AND DISPLAY APPARATUS
案件概要
出願人
Hefei BOE Ruisheng Technology Co., Ltd.; BOE TECHNOLOGY GROUP CO., LTD.
発明者
Yiding SUN; Bing ZHANG; Hai TANG; Liang GAO; Xiaolin GENG; Jianwei QIN; Xiao WANG
IPC分類
CPC分類
A light-emitting substrate includes a back plate, light-emitting groups, a bonding electrode group, and a flexible circuit structure including a gold finger electrically connected to the bonding electrode group. A light-emitting region of the light-emitting substrate is provided with at least one light-emitting group including a first light-emitting group. The bonding electrode group includes: a first bonding electrode and remaining bonding electrodes, and at least one redundant bonding electrode between the first bonding electrode and an adjacent remaining bonding electrode. A second power supply voltage terminal of the first light-emitting group and the first bonding electrode are electrically connected to a feedback signal line. On the back plate, an orthographic projection of the gold finger overlaps with an orthographic projection of the bonding electrode group. An impedance between the first bonding electrode and the adjacent remaining bonding electrode is larger than that between two adjacent and consecutive remaining bonding electrodes.
原文(中国語)
A light-emitting substrate includes a back plate, light-emitting groups, a bonding electrode group, and a flexible circuit structure including a gold finger electrically connected to the bonding electrode group. A light-emitting region of the light-emitting substrate is provided with at least one light-emitting group including a first light-emitting group. The bonding electrode group includes: a first bonding electrode and remaining bonding electrodes, and at least one redundant bonding electrode between the first bonding electrode and an adjacent remaining bonding electrode. A second power supply voltage terminal of the first light-emitting group and the first bonding electrode are electrically connected to a feedback signal line. On the back plate, an orthographic projection of the gold finger overlaps with an orthographic projection of the bonding electrode group. An impedance between the first bonding electrode and the adjacent remaining bonding electrode is larger than that between two adjacent and consecutive remaining bonding electrodes.
外部リソース