SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
案件概要
出願人
Taiwan Semiconductor Manufacturing Company, Ltd.
発明者
Kong-Beng THEI; Jing-Jung HUANG; Kuei-Kai HOU; Wen Han HSIEH
IPC分類
CPC分類
A semiconductor device (e.g., a microdisplay device) includes isolation structures around subpixels of at least a portion of the display pixels in the display pixel array of the semiconductor device. The isolation structures (e.g., isolation trenches, isolation rings) confine the light generated by the subpixels, enabling the light generated by the subpixels to be highly contained and collimated. Thus, the isolation structures reduce lateral dispersion of the light emitted by the subpixels, which reduces the amount of color mixing between the subpixels. This enables the display pixel array to generate images and/or video with highly accurate color representation and high contrast, among other examples.
原文(中国語)
A semiconductor device (e.g., a microdisplay device) includes isolation structures around subpixels of at least a portion of the display pixels in the display pixel array of the semiconductor device. The isolation structures (e.g., isolation trenches, isolation rings) confine the light generated by the subpixels, enabling the light generated by the subpixels to be highly contained and collimated. Thus, the isolation structures reduce lateral dispersion of the light emitted by the subpixels, which reduces the amount of color mixing between the subpixels. This enables the display pixel array to generate images and/or video with highly accurate color representation and high contrast, among other examples.
外部リソース