Micro LED transfer method and array substrate
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案件概要
出願番号
CN2018102730
発明者
ZOU XIANGXIANG; HE XIAOLONG
出願日
Jan 2, 2018
公開日
Jun 29, 2018
パテントファミリーID
62645228
IPC分類
CPC分類
The invention provides a micro LED transfer method and an array substrate. A photoresist pattern containing a big-end-down opening is formed on an organic layer of the array substrate, the upper edgeof the opening is smaller or equal to a to-be-transferred light-emitting component, therefore, after a transfer substrate carrying the to-be-transferred light-emitting component is aligned with the array substrate, the to-be-transferred light-emitting component can be firmly clamped in the opening by applying pressure to the transfer substrate, adhesion force of the to-be-transferred light-emitting component to the array substrate is increased, the risk that the to-be-transferred light-emitting component is carried away by the transfer substrate is reduced in a transfer plate removal process is reduced, transfer success rate is increased, product yield is increased, and dark spot defects are avoided.
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