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案件記録

Chip on film and display module

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91815325ファミリー
§ Ⅰ

案件概要

出願人

CHENGDU BOE DISPLAY TECH CO LTD; BOE TECHNOLOGY GROUP CO LTD

出願番号

CN202410444499

発明者

SUN XIAOYE; ZHENG LIMING; BAO YUFENG; ZHANG YIFAN; HE HENGSUO; MA CHUAN

出願日

Apr 12, 2024

公開日

Jul 16, 2024

パテントファミリーID

91815325

IPC分類

H01L23/498H01L23/60H05F3/02

CPC分類

H05F3/02H10W42/60H10W70/60

The invention provides a chip on film and a display module. The chip on film comprises a stacked substrate and a conductive layer, the insulating layer is arranged on the side, away from the substrate, of the conductive layer, and the orthographic projection of the insulating layer on the substrate covers the orthographic projection of the conductive layer on the substrate; the first electrostatic wire is arranged on the substrate and on the periphery of the conducting layer, the orthographic projection of the first electrostatic wire on the substrate does not coincide with the orthographic projection of the insulating layer on the substrate, and the first electrostatic wire is used for attracting and guiding out electrostatic charges on the periphery of the conducting layer; according to the invention, the first electrostatic wire is arranged at the periphery of the conductive layer, so that the electrostatic charges can be led out, the accumulation of the electrostatic charges in the edge area of the chip on film is avoided, the problems of short circuit or damage and the like caused by the migration of the electrostatic charges to the conductive layer or a driving element are prevented, and the product quality of the chip on film is improved.

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