Ultrasonic sensing device and manufacturing method

The invention discloses an ultrasonic sensing device and a manufacturing method, and the device comprises a substrate; the first conductive layer comprises a plurality of first binding pins; the buffer layer exposes at least partial area of each first binding pin; the inorganic layer comprises a plurality of first sub-parts, the orthographic projection of the first sub-parts on the substrate falls into the range of the orthographic projection of the first binding pins on the substrate, and spaces used for arranging sacrificial layers are formed between the first sub-parts and the first binding pins; a first opening is formed between the first sub-parts corresponding to each first binding pin, and the first opening is used for exposing the first binding pin; and a second conductive layer. When the inorganic layer and the packaging layer are manufactured, the opening is formed in the area corresponding to the first binding pin, and finally, the first binding pin can be exposed only by etching the buffer layer with relatively small thickness on the first binding pin, so that excessive etching of the second conductive layer can be avoided, and improvement of the product yield and the reliability of the device is facilitated.