Piezoresistive chip and preparation method thereof, and piezoresistive sensor
データ提供元:EPO OPS
本文を取得できませんでした。取得済みの書誌情報は引き続き確認できます。
案件概要
出願人
BEIJING BOE SENSING TECH CO LTD; BOE TECHNOLOGY GROUP CO LTD; BEIJING BOE TECHNOLOGY DEV CO LTD
出願番号
CN202410518379
発明者
WANG LIHUI; LI YUE; WEI QIUXU; GUO WEILONG; ZHANG TAONAN; CHANG WENBO; SUN JIE; HE NANA; LIU HANQING; DING DING
出願日
Apr 26, 2024
公開日
Aug 2, 2024
パテントファミリーID
92334479
IPC分類
CPC分類
The invention discloses a piezoresistive chip, a preparation method thereof and a piezoresistive sensor. The piezoresistive chip comprises a substrate provided with a pressure cavity and a Wheatstone bridge located on the substrate; the Wheatstone bridge comprises a plurality of piezoresistors, and the orthographic projections of the piezoresistors on the plane where the substrate is located are all located in the orthographic projection of the pressure cavity on the plane where the substrate is located; the plurality of piezoresistors at least comprise a first piezoresistor, a second piezoresistor, a third piezoresistor and a fourth piezoresistor which are connected with one another; the piezoresistive chip further comprises a shielding layer, the orthographic projection of the shielding layer on the plane where the substrate is located is at least partially overlapped with the orthographic projection of at least one piezoresistor on the plane where the substrate is located, the shielding layer is configured to be connected with a grounding end, and the long-term stability of the piezoresistive chip can be improved.
EPO 調査資料
項目を選択すると、この公開文献の公式資料を取得します。
上の項目を選択して資料を取得してください。
外部リソース