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案件記録

Wafer crack detection device and detection method

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92380429ファミリー
§ Ⅰ

案件概要

出願人

BEIJING BOE SENSING TECH CO LTD; BOE TECHNOLOGY GROUP CO LTD

出願番号

CN202410620049

発明者

XU SHUAI; HU-YANG DUANRUI; HOU XUECHENG; SUN LIANG; NING YUNLONG; QIN YIFENG; YANG JUNFENG; WANG DONGDONG

出願日

May 17, 2024

公開日

Aug 23, 2024

パテントファミリーID

92380429

IPC分類

G01N21/01G01N21/95

CPC分類

G01N21/01G01N21/9505

The invention provides a wafer crack detection device and a wafer crack detection method. The wafer crack detection device comprises a light shield; the detection assembly is located in the light shield, the detection assembly comprises a photosensitive sensor and a light source which are oppositely arranged, a gap is formed between the photosensitive sensor and the light source, and a wafer to be detected extends into the gap; wherein the wafer to be detected comprises an area to be detected, and the central axis of the photosensitive sensor and the central axis of the light source intersect in the area to be detected. If the crack exists in the to-be-detected area, the light emitted by the light source enters the photosensitive sensor after being reflected by the crack interface, so that the output information of the photosensitive sensor is different from the conventional information, and whether the crack exists in the wafer can be accurately detected based on the obtained output information of the photosensitive sensor; the detection efficiency, the detection precision and the accuracy are high, and the photosensitive sensor and the light source do not directly contact the wafer, so that the cleanliness of the wafer is ensured.

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