Wafer crack detection device and detection method
データ提供元:EPO OPS
本文を取得できませんでした。取得済みの書誌情報は引き続き確認できます。
案件概要
出願番号
CN202410620049
発明者
XU SHUAI; HU-YANG DUANRUI; HOU XUECHENG; SUN LIANG; NING YUNLONG; QIN YIFENG; YANG JUNFENG; WANG DONGDONG
出願日
May 17, 2024
公開日
Aug 23, 2024
パテントファミリーID
92380429
IPC分類
CPC分類
The invention provides a wafer crack detection device and a wafer crack detection method. The wafer crack detection device comprises a light shield; the detection assembly is located in the light shield, the detection assembly comprises a photosensitive sensor and a light source which are oppositely arranged, a gap is formed between the photosensitive sensor and the light source, and a wafer to be detected extends into the gap; wherein the wafer to be detected comprises an area to be detected, and the central axis of the photosensitive sensor and the central axis of the light source intersect in the area to be detected. If the crack exists in the to-be-detected area, the light emitted by the light source enters the photosensitive sensor after being reflected by the crack interface, so that the output information of the photosensitive sensor is different from the conventional information, and whether the crack exists in the wafer can be accurately detected based on the obtained output information of the photosensitive sensor; the detection efficiency, the detection precision and the accuracy are high, and the photosensitive sensor and the light source do not directly contact the wafer, so that the cleanliness of the wafer is ensured.
EPO 調査資料
項目を選択すると、この公開文献の公式資料を取得します。
上の項目を選択して資料を取得してください。
外部リソース