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案件記録

Backlight module, preparation method thereof and display device

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92381528ファミリー
§ Ⅰ

案件概要

出願人

BOE TECHNOLOGY GROUP CO LTD

出願番号

CN202310182016

発明者

LV ZHIJUN; ZHOU JINGSHANG; LIU WENQU; MENG DETIAN; CUI ZHAO; DONG LIWEN; ZHANG FENG; YAO QI; HOU DONGFEI; LI YUQIAO; DONG SHIHAO; ZHANG JIAXIANG

出願日

Feb 21, 2023

公開日

Aug 23, 2024

パテントファミリーID

92381528

IPC分類

G02F1/13357H01L25/075H01L33/62

CPC分類

G02F1/1336G02F1/133603G02F1/133605H10H20/857H10W90/00H10H20/0364

The invention relates to the technical field of display, and discloses a backlight module, a preparation method thereof and a display device. The backlight module is provided with a light-emitting area and a first non-light-emitting area, the first non-light-emitting area comprises a first binding area, a first bending area and a second binding area which are connected in sequence, and the first binding area is closer to the light-emitting area relative to the second binding area; the backlight module comprises a substrate, a first conductive layer, an insulating layer group and a second conductive layer which are sequentially stacked, the first conductive layer comprises a first binding pin and a connecting wire, and the first binding pin is connected with the first part connecting wire; the second conductive layer comprises a second binding pin, and the second binding pin is connected with the second part connecting wire; the first binding pin is located in the second binding area, and the second binding pin is located in the first binding area; or, the first binding pin is located in the first binding area, and the second binding pin is located in the second binding area. The partition density of the light-emitting area of the backlight module is high.

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