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案件記録

Substrate fixing device and light emitting diode transfer method

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92475569ファミリー
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案件概要

出願人

BOE TECHNOLOGY GROUP CO LTD

出願番号

CN202310183909

発明者

WANG CHENGFEI; YAN JUNWEI; CHEN ZHONGLIN; AN JINXIN; PEI GUANGHUI; ZHOU REN; CAO KANG; REN ZE

出願日

Feb 28, 2023

公開日

Aug 30, 2024

パテントファミリーID

92475569

IPC分類

H01L25/075H01L33/00H01L33/48H10P72/76

CPC分類

H10H20/018H10H20/85H10P72/74H10P72/7604H10P72/7608H10P72/7618H10P72/7624H10P72/78H10W90/00

The invention discloses a substrate fixing device and a light emitting diode transfer method, the fixing device comprises a carrying table, the carrying table comprises a carrying surface used for carrying a target substrate and supporting side walls located on two opposite sides of the carrying surface, and the carrying surface is provided with a plurality of air holes used for vacuum adsorption of the target carrying plate; the number of the fixing rods is multiple, the multiple fixing rods are arranged in parallel and detachably connected with the supporting side wall, and gaps used for containing target substrates are formed between the fixing rods and the carrying table; the fixing rod comprises a rod body and a clamping mechanism located on the rod body, and the clamping mechanism is configured to be capable of generating relative displacement with the bearing face and used for jointly applying acting force to the target substrate and a donor substrate located on the side, away from the carrying table, of the target substrate. According to the fixing device, acting force is applied to the donor substrate through the clamping mechanism, so that the donor substrate is pressed and fixed to the surface of the target substrate, and it is ensured that the donor substrate and the target substrate do not move relatively.

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