Semiconductor power module, motor controller and vehicle
データ提供元:EPO OPS
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案件概要
出願番号
CN202310237182
発明者
LIAN YUBO; LING HEPING; ZHAI ZHEN; LIU HAIJUN; ZHANG HAIXING
出願日
Mar 3, 2023
公開日
Sep 3, 2024
パテントファミリーID
92525209
IPC分類
CPC分類
The invention discloses a semiconductor power module, a motor controller and a vehicle, and the semiconductor power module comprises a first substrate which is provided with a DC positive electrode conductive region and a DC negative electrode conductive region; the second substrate is provided with an alternating current conducting area; the first chip is mounted in the direct-current positive electrode conductive region and is electrically connected with the direct-current positive electrode conductive region and the alternating-current conductive region; and the second chip is arranged in the alternating current conducting area and is electrically connected with the direct current negative electrode conducting area and the alternating current conducting area. The semiconductor power module has the advantages of being small in size, high in heat dissipation efficiency and the like.
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