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案件記録

Camera module and electronic equipment

その他/未提供不明

データ提供元:EPO OPS

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92717843ファミリー
§ Ⅰ

案件概要

出願人

HUAWEI TECH CO LTD

出願番号

CN202310268408

発明者

FAN XIANKAI; GUAN TIANKUI; JIANG HAIXIA; XIAO ZHUOJIE; LI LE

出願日

Mar 14, 2023

公開日

Sep 20, 2024

パテントファミリーID

92717843

IPC分類

G03B11/00G03B30/00H04M1/02H04N23/50H04N23/54H04N23/55H04N23/57H10W74/00

CPC分類

G02B7/006G02B7/025G03B11/00G03B30/00H04M1/02H04M1/0264H04N23/50H04N23/54H04N23/55H04N23/57G03B2217/002H04M2250/52

The invention provides a camera module and electronic equipment. The camera module comprises a circuit assembly, a motor, a lens, an image sensor, an adhesive and an optical filter. The motor is fixed to the circuit assembly. The lens is mounted on the motor. The image sensor is fixed and electrically connected to the circuit assembly. The first surface of the image sensor faces the lens. The first face includes an imaging region and an edge region surrounding the imaging region. The adhesive is fixed to the circuit assembly and surrounds the image sensor. Or the bonding glue is fixed on the edge area of the first surface. The optical filter is fixed to the surface, away from the circuit assembly, of the adhesive. The viscosity of the adhesive is greater than 10000 Cps, the thixotropic index is greater than 2, the Young modulus at room temperature is in a range of 1000 MPa to 10000 MPa, and the thermal expansion coefficient is less than 80 ppm/k. According to the camera module, the adhesive is arranged to replace a fixed step to support the optical filter, so that the camera module which is relatively high in photographing performance and relatively thin in thickness is obtained.

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