Refrigeration equipment
データ提供元:EPO OPS
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案件概要
出願番号
CN202322889351U
発明者
SHEN MENGLIANG
出願日
Oct 25, 2023
公開日
Jul 30, 2024
パテントファミリーID
92073232
IPC分類
The utility model discloses refrigeration equipment which comprises a box body, a semiconductor refrigeration module and a heat conducting gasket, and a chamber is formed in the box body. The semiconductor refrigeration module comprises a semiconductor refrigeration chip, a cold radiator and a radiator, the semiconductor refrigeration chip is provided with a cold end and a hot end, the cold end is connected with the cold radiator, the cold radiator is connected with the side wall of the chamber, the hot end is connected with the radiator, and the radiator is located outside the box body; the heat-conducting gasket is arranged between the box body and the radiator, so that part of heat of the radiator is guided to the box body through the heat-conducting gasket. When the semiconductor refrigeration module is started, cold energy of the cold end is transmitted to the chamber through the cold radiator to help cooling, heat of the hot end is radiated through the radiator, and operation of the semiconductor refrigeration chip is maintained. And by arranging the heat-conducting gasket, part of heat of the radiator is transferred to the outer wall of the box body, heat dissipation is facilitated, the heat dissipation effect is improved, and the refrigeration capacity of the semiconductor refrigeration module is improved.
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