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案件記録

Power semiconductor module, vehicle-mounted power supply and vehicle

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92354175ファミリー
§ Ⅰ

案件概要

出願人

BYD CO LTD

出願番号

CN202322890622U

発明者

WANG YINGHUI; ZHANG LEI; WANG CHAO

出願日

Oct 25, 2023

公開日

Aug 6, 2024

パテントファミリーID

92354175

IPC分類

H01L23/49H05K1/02

The utility model discloses a power semiconductor module, a vehicle-mounted power supply and a vehicle, the power semiconductor module comprises a housing and at least two groups of pins, the first group of pins and the second group of pins extend in the same direction from the inside of the housing to the outside of the housing; and the tail ends of the first group of pins and the tail ends of the second group of pins have a height difference in the extension direction. According to the power semiconductor module and the vehicle-mounted power supply provided by the utility model, the two groups of pins extending towards the same direction of the power semiconductor module have a height difference, so that when the two groups of pins are respectively connected to a circuit board loaded with a high-voltage power signal and a low-voltage control signal, the interference of the high-voltage power signal on the low-voltage signal is reduced; the stability of low-voltage control signals of the power semiconductor module is improved, and the performance of the vehicle-mounted power supply is improved.

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