Board-level structure, first device and electronic equipment

A board-level structure, a first device and an electronic apparatus wherein the board-level structure includes a second substrate and at least one first device. The first device comprises a first body and a first substrate, the first substrate is provided with a first welding spot and a second welding spot, and the first substrate is connected with the first body through the first welding spot. The second substrate is provided with an accommodating part and a third welding spot, the third welding spot is located on the second substrate and is close to the accommodating part, the first substrate is welded with the second substrate through the second welding spot and the third welding spot, the first substrate is bridged above the accommodating part, and at least part of the first body extends into the accommodating part. According to the invention, part of the Z-direction height of the first body can be absorbed through the accommodating part, the occupied space is reduced, and the first substrate can be directly welded on the second substrate through the second welding point and the third welding point, so that only a bonding pad needs to be molded on the surface of the second substrate in one process flow to be connected with the first substrate, the assembly process is simplified, and the production efficiency is improved. And the assembly quality is ensured.