Bare chip, chip and electronic component

The utility model discloses a bare chip, a chip and an electronic element, and belongs to the technical field of microelectronics. The bare chip comprises a substrate layer, an active layer, a waveguide layer and a bonding pad; the active layer is located between the substrate layer and the waveguide layer, the waveguide layer is provided with a ridge waveguide, and the bonding pad and the ridge waveguide are opposite in position in the thickness direction of the bare chip. According to the invention, the position of the bonding pad of the bare chip can be opposite to the position of the ridge waveguide in the thickness direction of the bare chip, so that the width of the bare chip can be reduced, the size of the bare chip is reduced, the number of the bare chips processed on a single wafer can be increased, the processing cost of the bare chips is reduced, and the processing efficiency of the bare chips is improved. Therefore, the cost of the electronic component where the bare chip is located is reduced, and the competitiveness of the electronic component in the industry is improved.