원래 이름 기록: Taiwan Semiconductor Manufacturing Company, LTD.

A semiconductor package includes one or more semiconductor dies, and a lid disposed on the one or more semiconductor dies. One or more thermoelectric coolers are disposed on or in the lid. Each thermoelectric cooler is positioned at a predetermined hotspot of the one or more semiconductor dies. In one method of operating such a semiconductor package, functions are run on one or more semiconductor dies of the semiconductor package. During the running of these functions, one or more predetermined hotspots of the one or more semiconductor dies are cooled by operating a thermoelectric cooler positioned at each respective predetermined hotspot.