원래 이름 기록: APPLIED MATERIALS, INC.

A substrate support assembly includes a ceramic puck configured to support a substrate and a cooling plate in thermal communication with the ceramic puck. The substrate support assembly further includes a spring pressure plate disposed beneath the cooling plate. The spring pressure plate includes multiple spring elements configured to each apply an approximately equal force to the cooling plate. The substrate support assembly further includes a plurality of fasteners configured to removably couple the spring plate and the cooling plate to the ceramic puck.