№ EP4676170A1발명
심사 중PRINTED CIRCUIT BOARD STRUCTURE ACCOMMODATING THERMAL INTERFACE MATERIAL, AND ELECTRONIC DEVICE COMPRISING SAME
PRINTED CIRCUIT BOARD STRUCTURE ACCOMMODATING THERMAL INTERFACE MATERIAL, AND ELECTRONIC DEVICE COMPRISING SAME
❖Samsung Electronics Co., LtdKIM, Joohan; CHO, Yonglak; PARK, MinJan 6, 2026H05K, H05K, C09K16