원래 이름 기록: SHENZHEN SHOKZ CO., LTD.

The present disclosure discloses a headphone, and the headphone comprises a speaker assembly and a wearing assembly. The speaker assembly includes a bone conduction speaker. The bone conduction speaker includes a core housing, a first vibration transmitting plate, a transducer, a vibration plate, and a lead wire. The first vibration transmitting plate includes an inner ring fixing portion, an outer ring fixing portion, and at least two elastic connecting portions. The at least two elastic connecting portions are connected between the inner ring fixing portion and the outer ring fixing portion, the inner ring fixing portion is connected to the transducer, the outer ring fixing portion is connected to the core housing, so that the transducer is suspended in the core housing, and the vibration plate is connected to the transducer. The lead wire is connected to the transducer and includes a first lead portion extending from the inner ring fixing portion to the outer ring fixing portion. A dimension of the first vibration transmitting plate along a long axis direction is larger than a dimension of the first vibration transmitting plate along a short axis direction, and an angle between the first lead portion and the long axis direction is less than an angle between the first lead portion and the short axis direction. In this way, the structural stability of the speaker assembly can be enhanced.

Provides an earphone including a wearing component, a speaker component, and a stick microphone component. The wearing component is connected to the speaker component, and the stick microphone component is rotatably disposed on the speaker component around a preset axis. The stick microphone component includes a stick assembly and a microphone assembly. The microphone assembly is fixedly connected to the stick assembly. The stick assembly is configured to position the microphone assembly in a sound pickup area corresponding to a mouth of a user when the earphone is in a wearing state. The stick assembly includes an elastic sheet and an elastic covering body covering the elastic sheet, the elastic sheet has a thickness direction and a width direction perpendicular to each other, the elastic sheet includes a smaller size in the thickness direction than in the width direction. The thickness direction is set toward or away from a face of the user in the wearing state. By the above, it is possible to make the structure of the stick microphone component more flexible.

Provides an earphone including a wearing component, a speaker component, and a stick microphone component. The wearing component is connected to the speaker component, and the stick microphone component is rotatably disposed on the speaker component around a preset axis. The stick microphone component includes a stick assembly and a microphone assembly. The microphone assembly is fixedly connected to the stick assembly. The stick assembly is configured to position the microphone assembly in a sound pickup area corresponding to a mouth of a user when the earphone is in a wearing state. The stick assembly includes an elastic sheet and an elastic covering body covering the elastic sheet, the elastic sheet has a thickness direction and a width direction perpendicular to each other, the elastic sheet includes a smaller size in the thickness direction than in the width direction. The thickness direction is set toward or away from a face of the user in the wearing state. By the above, it is possible to make the structure of the stick microphone component more flexible.

The present disclosure provides an earphone, which relates to the technical field of electronic devices. The earphone includes a headband assembly, a connecting assembly, and a speaker assembly; the connecting assembly includes a fixing assembly and a telescoping assembly, the fixing assembly includes a housing assembly and a locking member, the housing assembly includes a first housing and a second housing, the telescoping assembly includes a telescoping member; the housing assembly is provided with a plugging hole, the headband assembly has a plugging portion, the plugging portion is plugged within the plugging hole along a telescoping direction, the locking member is disposed to lock the first housing and the plugging portion along the telescoping direction, the second housing is provided with a first limiting portion and a second limiting portion. In the earphone provided in the present disclosure, the locking member locks the first housing and the plugging portion along the telescoping direction, the first limiting portion and the second limiting portion limit a movement of the second housing along the telescoping direction, and the second housing does not need to be provided with a connection hole. The thickness of the second housing at a junction between the headband assembly and the connecting assembly can be reduced, thereby reducing the dimension of the second housing and facilitating the miniaturization of the earphone.

The present disclosure provides an earphone, which relates to the technical field of electronic devices. The earphone includes a headband assembly, a connecting assembly, and a speaker assembly; the connecting assembly includes a fixing assembly and a telescoping assembly, the fixing assembly includes a housing assembly and a locking member, the housing assembly includes a first housing and a second housing, the telescoping assembly includes a telescoping member; the housing assembly is provided with a plugging hole, the headband assembly has a plugging portion, the plugging portion is plugged within the plugging hole along a telescoping direction, the locking member is disposed to lock the first housing and the plugging portion along the telescoping direction, the second housing is provided with a first limiting portion and a second limiting portion. In the earphone provided in the present disclosure, the locking member locks the first housing and the plugging portion along the telescoping direction, the first limiting portion and the second limiting portion limit a movement of the second housing along the telescoping direction, and the second housing does not need to be provided with a connection hole. The thickness of the second housing at a junction between the headband assembly and the connecting assembly can be reduced, thereby reducing the dimension of the second housing and facilitating the miniaturization of the earphone.

The present disclosure provides an earphone and a wearing component. The wearing component comprises a headband component including a clamping component, a wire, and a first elastic wrapping body. The clamping component has a length direction, a thickness direction, and a width direction, the clamping component has a curved shape along the length direction, so that the headband component is wound around a top of a head of a user and provides a clamping force when the wearing component is in a wearing state, a dimension of the clamping component along the width direction is greater than a dimension of the clamping component along the thickness direction, and the thickness direction faces or is away from the head of the user when the wearing component is in the wearing state.

The present disclosure provides an earphone, which relates to the technical field of electronic devices. The earphone includes a headband assembly, a connecting assembly, and a speaker assembly; the connecting assembly includes a fixing assembly and a telescoping assembly, the fixing assembly includes a housing assembly and a locking member, the housing assembly includes a first housing and a second housing, the telescoping assembly includes a telescoping member; the housing assembly is provided with a plugging hole, the headband assembly has a plugging portion, the plugging portion is plugged within the plugging hole along a telescoping direction, the locking member is disposed to lock the first housing and the plugging portion along the telescoping direction, the second housing is provided with a first limiting portion and a second limiting portion. In the earphone provided in the present disclosure, the locking member locks the first housing and the plugging portion along the telescoping direction, the first limiting portion and the second limiting portion limit a movement of the second housing along the telescoping direction, and the second housing does not need to be provided with a connection hole. The thickness of the second housing at a junction between the headband assembly and the connecting assembly can be reduced, thereby reducing the dimension of the second housing and facilitating the miniaturization of the earphone.

The present disclosure discloses a headphone, and the headphone comprises a speaker assembly and a wearing assembly. The speaker assembly includes a bone conduction speaker. The bone conduction speaker includes a core housing, a first vibration transmitting plate, a transducer, a vibration plate, and a lead wire. The first vibration transmitting plate includes an inner ring fixing portion, an outer ring fixing portion, and at least two elastic connecting portions. The at least two elastic connecting portions are connected between the inner ring fixing portion and the outer ring fixing portion, the inner ring fixing portion is connected to the transducer, the outer ring fixing portion is connected to the core housing, so that the transducer is suspended in the core housing, and the vibration plate is connected to the transducer. The lead wire is connected to the transducer and includes a first lead portion extending from the inner ring fixing portion to the outer ring fixing portion. A dimension of the first vibration transmitting plate along a long axis direction is larger than a dimension of the first vibration transmitting plate along a short axis direction, and an angle between the first lead portion and the long axis direction is less than an angle between the first lead portion and the short axis direction. In this way, the structural stability of the speaker assembly can be enhanced.

The present disclosure discloses a headphone, and the headphone comprises a speaker assembly and a wearing assembly. The speaker assembly includes a bone conduction speaker. The bone conduction speaker includes a core housing, a first vibration transmitting plate, a transducer, a vibration plate, and a lead wire. The first vibration transmitting plate includes an inner ring fixing portion, an outer ring fixing portion, and at least two elastic connecting portions. The at least two elastic connecting portions are connected between the inner ring fixing portion and the outer ring fixing portion, the inner ring fixing portion is connected to the transducer, the outer ring fixing portion is connected to the core housing, so that the transducer is suspended in the core housing, and the vibration plate is connected to the transducer. The lead wire is connected to the transducer and includes a first lead portion extending from the inner ring fixing portion to the outer ring fixing portion. A dimension of the first vibration transmitting plate along a long axis direction is larger than a dimension of the first vibration transmitting plate along a short axis direction, and an angle between the first lead portion and the long axis direction is less than an angle between the first lead portion and the short axis direction. In this way, the structural stability of the speaker assembly can be enhanced.