№ EP4674921A1발명
심사 중ADHESIVE COMPOSITION, ADHESIVE TAPE, METHOD FOR PROCESSING SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
ADHESIVE COMPOSITION, ADHESIVE TAPE, METHOD FOR PROCESSING SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
❖Sekisui Chemical Co., Ltd.ZHANG, Ye; UEDA, Kozo; OGATA, Yudai; TAKIJIRI, AyaJan 6, 2026C09J, C09J, C09J +325