№ US20260002060A1발명
심사 중TWO-COMPONENT THERMALLY-CONDUCTIVE STRUCTURAL ADHESIVE
TWO-COMPONENT THERMALLY-CONDUCTIVE STRUCTURAL ADHESIVE
Provided herein is a two-component thermally-conductive epoxy adhesive.
❖DDP SPECIALTY ELECTRONIC MATERIALS US, LLCFelix KOCH; Beda STEINER§ 1/15 청구항C9J 163/, C9J 9/, C9J 11/6 +120