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기록

COMPONENT POSITIONING AND ENCAPSULATION FOR SENSOR ENABLED WOUND DRESSINGS

발명심사 중
3조회수
25청구항 · 7 독립항
§ Ⅰ

개요

IPC 분류

A61F 13/A61B 5/531A61F 13/84

CPC 분류

A61F13/991A61B5/531A61F13/51A61F2013/8473

Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes applying a first coating on a first side of a flexible substrate of the wound dressing. The first side of the substrate can support a plurality of electronic components, electronic tracks, and connectors between the electronic components and electronic tracks. The first coating can be applied to at least one connectors. The application of the first coating can strengthen the at least one connector. The method can further include applying a second biocompatible coating on the first side of the substrate of the wound dressing and coating a second side of the substrate opposite the first side with a third coating, and coating at least some of the plurality of the electronic components with a fourth coating.

원문 (중국어)

Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes applying a first coating on a first side of a flexible substrate of the wound dressing. The first side of the substrate can support a plurality of electronic components, electronic tracks, and connectors between the electronic components and electronic tracks. The first coating can be applied to at least one connectors. The application of the first coating can strengthen the at least one connector. The method can further include applying a second biocompatible coating on the first side of the substrate of the wound dressing and coating a second side of the substrate opposite the first side with a third coating, and coating at least some of the plurality of the electronic components with a fourth coating.