METHOD AND APPARATUS FOR LASER PROCESSING
개요
출원인
SHANGHAI NAGOYA PRECISION TOOLS CO., LTD.
발명자
SI-RUI SUN
IPC 분류
CPC 분류
A method for cutting a material using a laser beam, comprising: providing a first wedge prism () and a second wedge prism () on a propagation path of a laser beam (), and enabling the laser beam to enter the first wedge prism at an incident angle greater than 0 degree and less than 90 degrees and then to enter the second wedge prism at an incident angle greater than 0 degree and less than 90 degrees; focusing, by using a focusing wedge prism (), the laser beam emitted from the second wedge prism and then applying the focused laser beam on a material (); and deviating the position of the second wedge prism relative to the first wedge prism, and then forming a laser processing pattern on the material.
원문 (중국어)
A method for cutting a material using a laser beam, comprising: providing a first wedge prism () and a second wedge prism () on a propagation path of a laser beam (), and enabling the laser beam to enter the first wedge prism at an incident angle greater than 0 degree and less than 90 degrees and then to enter the second wedge prism at an incident angle greater than 0 degree and less than 90 degrees; focusing, by using a focusing wedge prism (), the laser beam emitted from the second wedge prism and then applying the focused laser beam on a material (); and deviating the position of the second wedge prism relative to the first wedge prism, and then forming a laser processing pattern on the material.