METHOD, SYSTEM AND APPARATUS FOR PROCESSING SYSTEM COMPONENT SURFACE MODIFICATION
개요
발명자
David Groechel; Christopher Falcone; Osama Khalil; Ryan Peters; Jeffrey Hintz
IPC 분류
CPC 분류
In an aspect, disclosed herein are a methods, systems and apparatus for modifying a component surface comprising, contacting the surface, with an laser beam, the surface comprising a semiconductor tool manufacturing component; modifying the surface responsive to the contacting, wherein the modifying the surface comprises forming, by micro-machining, etching, ablating, ionizing, anodizing, oxidizing, texturing, or roughening, or a combination thereof, a functional feature in the surface.
원문 (중국어)
In an aspect, disclosed herein are a methods, systems and apparatus for modifying a component surface comprising, contacting the surface, with an laser beam, the surface comprising a semiconductor tool manufacturing component; modifying the surface responsive to the contacting, wherein the modifying the surface comprises forming, by micro-machining, etching, ablating, ionizing, anodizing, oxidizing, texturing, or roughening, or a combination thereof, a functional feature in the surface.