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기록

CYLINDRICAL GRINDING DEVICE, CYLINDRICAL GRINDING METHOD, AND WAFER MANUFACTURING METHOD

발명심사 중
21청구항 · 2 독립항
§ Ⅰ

개요

출원인

SUMCO CORPORATION

발명자

Tomohito KOHINATA; Takahiro KANEHARA

IPC 분류

B24B 27/6B24B 7/22B24B 41/6

CPC 분류

B24B27/6B24B7/228B24B41/61

A cylindrical grinding apparatus produces a monocrystal for slicing by cylindrical grinding an outer circumferential surface of a monocrystal for grinding while rotating the monocrystal for grinding around a rotation axis. The cylindrical grinding apparatus includes: an attitude correcting section for correcting an attitude of the monocrystal for grinding to incline a center axis thereof with respect to the rotation axis, by rotating the monocrystal for grinding around the center axis and turning the monocrystal for grinding around a turn axis orthogonal to the center axis based on a plane orientation difference between a plane orientation of the monocrystal for grinding and a target plane orientation of a wafer to be obtained by slicing the monocrystal for slicing; and a grinding section for cylindrically grinding the outer circumferential surface of the monocrystal for grinding while rotating the monocrystal for grinding whose attitude has been corrected around the rotation axis.

원문 (중국어)

A cylindrical grinding apparatus produces a monocrystal for slicing by cylindrical grinding an outer circumferential surface of a monocrystal for grinding while rotating the monocrystal for grinding around a rotation axis. The cylindrical grinding apparatus includes: an attitude correcting section for correcting an attitude of the monocrystal for grinding to incline a center axis thereof with respect to the rotation axis, by rotating the monocrystal for grinding around the center axis and turning the monocrystal for grinding around a turn axis orthogonal to the center axis based on a plane orientation difference between a plane orientation of the monocrystal for grinding and a target plane orientation of a wafer to be obtained by slicing the monocrystal for slicing; and a grinding section for cylindrically grinding the outer circumferential surface of the monocrystal for grinding while rotating the monocrystal for grinding whose attitude has been corrected around the rotation axis.