DIAMETER-WIRE DICING MACHINE
개요
출원인
MICRON DIAMOND WIRE & EQUIPMENT CO., LTD.
발명자
Cheng-Ming LEE
IPC 분류
CPC 분류
A diamond-wire dicing machine includes a machine chassis, which includes a bottom support. A base extends upwards from the bottom support. A plurality of tension regulation arms are arranged on the base and are each provided with a tension roller. A plurality of guide rollers are also arranged on the base. The tension rollers and the guide rollers are spaced from each other. A plurality of wire winding/releasing devices are respectively arranged at two sides of the base and are each provided with a wire winding/unwinding wheel. A diamond wire extends through the tension rollers, the guide rollers, and the wire winding/unwinding wheels, and the surface of the diamond wire is provided with diamond particles. The wire winding/releasing devices are operable to take up and release the diamond wire for reciprocally moving the diamond wire to bring new ones of the diamond particles to contact and cut a wafer.
원문 (중국어)
A diamond-wire dicing machine includes a machine chassis, which includes a bottom support. A base extends upwards from the bottom support. A plurality of tension regulation arms are arranged on the base and are each provided with a tension roller. A plurality of guide rollers are also arranged on the base. The tension rollers and the guide rollers are spaced from each other. A plurality of wire winding/releasing devices are respectively arranged at two sides of the base and are each provided with a wire winding/unwinding wheel. A diamond wire extends through the tension rollers, the guide rollers, and the wire winding/unwinding wheels, and the surface of the diamond wire is provided with diamond particles. The wire winding/releasing devices are operable to take up and release the diamond wire for reciprocally moving the diamond wire to bring new ones of the diamond particles to contact and cut a wafer.