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기록

MODULAR PACKAGING SYSTEM FOR PACKAGING OF MEDICAL ARTICLES AND MODULES FOR A MODULAR PACKAGING SYSTEM FOR MEDICAL ARTICLES

발명심사 중
15청구항 · 5 독립항
§ Ⅰ

개요

IPC 분류

B65B 59/4B65B 57/B65B 65/

CPC 분류

B65B59/4B65B57/B65B65/3

A main module () for a modular packaging system for packaging of medical articles, wherein the main module () comprises a main control unit (mCU), a mounting backbone structure () configured to receive a plurality of sub-modules (_-_), a plurality of main-module communication interfaces (I_-I_nm), each associated with a specific order position of a sub-module, and wherein the main control unit (mCU) is configured to receive a sub-module identification via the main-module communication interfaces (I_-I_nm), and the sub-module identification at least gives access to at least one dimensional parameter of a sub-module (_-_).

원문 (중국어)

A main module () for a modular packaging system for packaging of medical articles, wherein the main module () comprises a main control unit (mCU), a mounting backbone structure () configured to receive a plurality of sub-modules (_-_), a plurality of main-module communication interfaces (I_-I_nm), each associated with a specific order position of a sub-module, and wherein the main control unit (mCU) is configured to receive a sub-module identification via the main-module communication interfaces (I_-I_nm), and the sub-module identification at least gives access to at least one dimensional parameter of a sub-module (_-_).