CNIPA.AI
검색으로 돌아가기
기록

THERMOPLASTIC COMPOSITION FOR LASER DIRECT STRUCTURING

발명심사 중
1조회수
22청구항 · 3 독립항
§ Ⅰ

개요

발명자

Bernardus Antonius Gerardus SCHRAUWEN; Fabio PAOLUCCI

IPC 분류

C8G 64/4C8K 3/11

CPC 분류

C8G64/4C8K3/11

A thermoplastic composition having an aromatic polycarbonate and a copper chromite spinel laser direct structuring additive. The composition includes a) 85-95 wt. % of an aromatic polycarbonate; b) 2-15 wt. % of a copper chromite spinel laser direct structuring additive, c) 0.05-5 wt. % of a flame retardant, which is a flame retardant salt or organic flame retardant, d) 0.1-2 wt. % of an acid-modified polymer, and e) optionally 0-5 wt. % of a siloxane based rubber. A molded part having the composition, a process for producing a circuit carrier with the molded part, and to a circuit carrier obtainable by the process.

원문 (중국어)

A thermoplastic composition having an aromatic polycarbonate and a copper chromite spinel laser direct structuring additive. The composition includes a) 85-95 wt. % of an aromatic polycarbonate; b) 2-15 wt. % of a copper chromite spinel laser direct structuring additive, c) 0.05-5 wt. % of a flame retardant, which is a flame retardant salt or organic flame retardant, d) 0.1-2 wt. % of an acid-modified polymer, and e) optionally 0-5 wt. % of a siloxane based rubber. A molded part having the composition, a process for producing a circuit carrier with the molded part, and to a circuit carrier obtainable by the process.