RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD
개요
출원인
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
발명자
Hajime OGUSHI; Hayate HIRONO; Takatoshi MITO; Koichi ISAJI; Hiroyuki FUJISAWA
IPC 분류
CPC 분류
A resin composition contains a preliminary reaction product (A) obtained by previously reacting a mixture containing a polyphenylene ether compound (a1) having at least one of a hydroxyl group and a carboxyl group in a molecule and a carbodiimide compound (a2), and a reactive compound (B) having an unsaturated double bond in a molecule.
원문 (중국어)
A resin composition contains a preliminary reaction product (A) obtained by previously reacting a mixture containing a polyphenylene ether compound (a1) having at least one of a hydroxyl group and a carboxyl group in a molecule and a carbodiimide compound (a2), and a reactive compound (B) having an unsaturated double bond in a molecule.