PROTECTIVE FILM FORMATION AGENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
개요
발명자
Hitomi MANIWA; Tetsuro KINOSHITA
IPC 분류
CPC 분류
A protective film forming agent for forming a protective film on a surface of a semiconductor wafer in dicing the semiconductor wafer, in which the protective film forming agent can form a protective film having excellent laser processability and reduced occurrence of cracks, and a method of manufacturing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light absorbing agent, at least one monosaccharide or disaccharide plasticizer, and a solvent. The water-soluble resin may include a water-soluble resin having an aromatic ring and a water-soluble group.
원문 (중국어)
A protective film forming agent for forming a protective film on a surface of a semiconductor wafer in dicing the semiconductor wafer, in which the protective film forming agent can form a protective film having excellent laser processability and reduced occurrence of cracks, and a method of manufacturing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light absorbing agent, at least one monosaccharide or disaccharide plasticizer, and a solvent. The water-soluble resin may include a water-soluble resin having an aromatic ring and a water-soluble group.