ELECTROCONDUCTIVE COMPOSITION, ELECTROCONDUCTIVE ADHESIVE, AND CURED PRODUCT
개요
발명자
Takashi SUZUKI; Satoru ENDO
IPC 분류
CPC 분류
Connection resistance can be reduced when an electroconductive composition is used to electrically connect base metals each other or electrically connect a base metal and another material. The connection resistance can be reduced when at least one base metal is used as an object to be electrically connected. An electroconductive composition contains components (A) to (D): a component (A): an epoxy resin; a component (B): a thermally curing agent; a component (C): a nickel powder as an electroconductive powder; and a component (D): an organoaluminum complex.
원문 (중국어)
Connection resistance can be reduced when an electroconductive composition is used to electrically connect base metals each other or electrically connect a base metal and another material. The connection resistance can be reduced when at least one base metal is used as an object to be electrically connected. An electroconductive composition contains components (A) to (D): a component (A): an epoxy resin; a component (B): a thermally curing agent; a component (C): a nickel powder as an electroconductive powder; and a component (D): an organoaluminum complex.