PHOTOCURABLE RESIN FOR PRESSURE-SENSITIVE, ANISOTOPICALLY-CONDUCTIVE ADHESIVES AND METHODS OF MAKING AND USING THE SAME

원문 (중국어)

Pressure-sensitive, anisotopically-conductive adhesives comprising a radiation-cured resin having aligned conductive particles therein and methods of making and processing are disclosed herein. The pressure-sensitive, anisotopically-conductive adhesive wherein the pressure-sensitive, anisotropically-conductive adhesive has a higher electrical conductivity in a direction parallel to the aligned conductive particles than in a direction perpendicular to the aligned conductive particles, wherein the resin prior to curing comprises: from 25-70% by wt. of one or more acrylic or methacrylic oligomers mixtures, from 5-60% by wt. of a reactive diluent, from 0-25% by wt. of an adhesion promoter, and an effective amount of a photoinitiator to initiate the curing of the resin when exposed to radiation; and wherein the resin prior to curing is mixed with the conductive particles in an amount below a percolation threshold.