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기록

EXTENSIBLE HIGH PUNCTURE-RESISTANT RECYCLABLE PAPER-BASED PACKAGING STRUCTURES

발명심사 중
1조회수
23청구항 · 2 독립항
§ Ⅰ

개요

발명자

Adam J. Edinger; Raymond J. Recchia; Seyed Hesamoddin Tabatabaei; Amir Saffar

IPC 분류

D21H 19/82B65D 65/42D21H 19/10

CPC 분류

D21H19/824B65D65/42D21H19/10

Recyclable, paper-based packaging structures and articles comprise extensible or semi-extensible paper layer with an anisotropy ratio in the range of 0.67 to 1.5 and a polymer extrusion coating layer. Methods for forming same are also provided. The structures and articles have a puncture resistance of 3 lbf or greater. Recyclable, paper-based packaging structures and articles and methods are formed using a polymer extrusion coating layer disposed on one side of an extensible or semi-extensible paper layer having an anisotropy ratio in the range of 0.67 to 1.5. A second polymer extrusion coating layer is disposed on a second side of the paper substrate layer. Advantageously, the paper substrates have a puncture resistance in the range of 3 lbf to 13.5 lbf.

원문 (중국어)

Recyclable, paper-based packaging structures and articles comprise extensible or semi-extensible paper layer with an anisotropy ratio in the range of 0.67 to 1.5 and a polymer extrusion coating layer. Methods for forming same are also provided. The structures and articles have a puncture resistance of 3 lbf or greater. Recyclable, paper-based packaging structures and articles and methods are formed using a polymer extrusion coating layer disposed on one side of an extensible or semi-extensible paper layer having an anisotropy ratio in the range of 0.67 to 1.5. A second polymer extrusion coating layer is disposed on a second side of the paper substrate layer. Advantageously, the paper substrates have a puncture resistance in the range of 3 lbf to 13.5 lbf.