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기록

COOLING DEVICE HAVING A COVER ASSEMBLY, COVER ASSEMBLY AND METHOD FOR ASSEMBLING A COVER ASSEMBLY

발명심사 중
5조회수
20청구항 · 3 독립항
§ Ⅰ

개요

발명자

Veysel TEKCE; Irem TETIK; Kaan Sezgin KARADAG; Dogan KILINC

IPC 분류

F25D 23/6F25D 23/2

CPC 분류

F25D23/66F25D23/28F25D23/62

A cooling device includes a body, a first user compartment, an inner frame including side and rear panels, a second compartment separated from the first by the rear panel, a cooling unit in the second compartment, a unit cover on the rear panel enclosing and separating the cooling unit from the first compartment. The unit cover has a cover front surface facing the first compartment. A partition wall separates the first compartment into first and second storage parts with the partition wall on the cover front surface. The cover front surface has a first cover surface facing the first storage part and an assembly surface adjacent the first cover surface and having a thickness. An outer coating coats the first cover surface and the thickness. The assembly surface is hidden by the partition wall on the unit cover. A cover assembly and method for assembly thereof are also provided.

원문 (중국어)

A cooling device includes a body, a first user compartment, an inner frame including side and rear panels, a second compartment separated from the first by the rear panel, a cooling unit in the second compartment, a unit cover on the rear panel enclosing and separating the cooling unit from the first compartment. The unit cover has a cover front surface facing the first compartment. A partition wall separates the first compartment into first and second storage parts with the partition wall on the cover front surface. The cover front surface has a first cover surface facing the first storage part and an assembly surface adjacent the first cover surface and having a thickness. An outer coating coats the first cover surface and the thickness. The assembly surface is hidden by the partition wall on the unit cover. A cover assembly and method for assembly thereof are also provided.